Xinlinx zynq7010 domestic replacement fmql10s400 national production arm core board + expansion board

TES710D It's based on FMQL10S400 National production
Chemical core board . The core board will FMQL10S400（ compatible FMQL20S400） The smallest system of is integrated in one 50*70mm On the core board , It can be used as a core module , Functional expansion , Especially in the field of control , Can play its unique advantages . The main chip of this core board is compatible XILINX Of ZYNQ7010 or ZYNQ7020 series FPGA. The core board is covered with DDR3 SDRAM、EMMC、SPI FLASH、 Ethernet PHY Chips, etc . Through two board to board connectors PL End IO An extension of .
The board is mainly used in the field of control or graphics and image processing .

A physical picture

Functional block diagram

Product components 100% Domestic independent controllable .

Technical indicators
 On board FPGA Real time processors ：
 FPGA model ：FMQL10S400（ compatible FMQL20S400）;
 Logical resources ：28K Logic Cells（~430K equivalent ASIC door ）;
 Package size ：FCBGA400,17*17mm, Fully compatible with ZYNQ7010;

Dynamic cache metrics ：
 Number of caches ：2 slice DDR3 SDRAM Grain ;
 Chip model ：SCB13H4G160AF;
 Cache bandwidth ：32 Bit data bus , The working clock is not lower than 500MHz;
 Cache capacity ：≥2GByte;

Nonvolatile storage ：
 QSPI FLASH：GD25Q256D, Capacity 256Mbit;
 EMMC： FEMDRW008G, Capacity 8GByte;

Ethernet interface ：
 Chip model ：YT8531H;;
 Support 10M/100M/1000M Adaptive Ethernet ;

Other interface performance ：
 Crystal oscillator ：PL Client support 1 road 50MHz The clock ,PS Client support 1 road 33.33Mhz
The clock ;
 Board to board connectors ：2 individual 120Pin be located Bottom layer ;

Physical and electrical characteristics
 Board size ：50 x 70mm
 Board power supply ：1A [email protected]+12V（±5%）
 The way of cooling ： Natural air cooling or metal cooling

Environmental characteristics
 working temperature ：-40°~﹢85°C;
 Storage temperature ：-55°~﹢125°C;
 Working humidity ：5%~95%, non-condensing

Software support
 Optional integrated board level software development kit （BSP）：
 Support Linux Transplantation of operating system ;
 Support the underlying interface driver ;
 Support peripheral interface expansion
 Customized hardware design and software integration can be provided according to customer needs ：

notes ：1、 This product adopts 100% Domestic self controlled components
2、 The core board is equipped with corresponding expansion board

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