4-channel fmc+ baseband signal processing board (4-channel 2G instantaneous bandwidth ad+da)

TES643 It's based on Virtex UltraScale+ series FPGA+C6678DSP Baseband signal processing platform , The platform uses 1 slice TI Of KeyStone Series multicore DSP TMS320C6678 As a floating-point algorithm processing unit , use 2 slice Xilinx Of Virtex UltraScale+ series FPGA XCVU9P As a signal preprocessing and real-time processing unit , have 4 individual FMC Sub card interface , Each node is interconnected through high-speed serial bus , The FPGA Maximum support 32Gbps High speed serial bus , Apply to 100G Ethernet 、JESD204B Wait for the high-speed interface . The board adopts embedded non-standard structure , It has excellent anti vibration design 、 Heat dissipation performance and unique environmental protection design , Suitable for ultra bandwidth baseband signal processing 、 multiple AD/DA Such as synchronous acquisition and processing .

Logic block diagram

A physical picture

Performance indicators

 1 Multiple cores DSP Processing nodes ：TMS320C6678;
 2 individual VirtexUltraScale+ series  FPGA Processing nodes ：XCVU9P;

Processing performance ：
 DSP Fixed point operation ：40GMAC/Core8=320GMAC;
 DSP Floating point operation ：20GFLOPs/Core8=160GFLOPs;

Storage performance ：
 DSP Processing nodes ：2GByteDDR3-1333SDRAM;
 DSP Processing nodes ：4GByteNandFlash;
 FPGA2 Processing nodes ： Each group 2GByteDDR4SDRAM, common 4 Group , Each group 64 Bitwidth ;

Interconnection performance ：
 DSP And FPGA：SRIO[email protected]/lane;
 FPGA1 And FPGA2：GTY[email protected]/lane;
 FPGA2 And FMC Interface ：LVDSx80;
 FPGA2 And FMC Interface ：8 road GTY[email protected]/lane;
 FPGA1 plugin 4 road QSFP28 Optical fiber , Support 4 road 100G Ethernet ;
 DSP plugin 1 road RJ45 Gigabit Ethernet ;

Physical and electrical characteristics 
 Board size ：217*360mm
 Board power supply ：6A[email protected]+12V（±5%）
 The way of cooling ： Metal cooling 

Environmental characteristics 
 working temperature ：-40°~﹢85°C,
 Storage temperature ：-55°~﹢125°C;
 Working humidity ：5%~95%, non-condensing 

Software support
 Optional integrated board level software development kit （BSP）：
 DSP Bottom interface driver ;
 FPGA Bottom interface driver ;
 Board level interconnection interface driver ;
 be based on SYS/BIOS The underlying driver of multi-core parallel processing ;
 Customized algorithm and system integration can be provided according to requirements ：

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