4-channel FMC interface baseband signal processing board (2 FMC interfaces, 2 fmc+ interfaces)

TES641 It's based on Virtex UltraScale+ series FPGA A high performance 4 road FMC Interface baseband signal processing platform , The platform uses 1 slice Xilinx Of Virtex UltraScale+ series FPGA XCVU13P As a real-time signal processing unit , This board has 4 individual FMC Sub card interface （ Among them is 2 A for FMC+ Interface ）, Each node is interconnected through high-speed serial bus , The FPGA Maximum support 32Gbps High speed serial bus , Apply to 100G Ethernet 、JESD204B/JESD204C Wait for the high-speed interface . The board adopts embedded non-standard structure , It has excellent anti vibration design 、 Heat dissipation performance and unique environmental protection design , Suitable for ultra bandwidth baseband signal processing 、 multiple AD/DA Such as synchronous acquisition and processing .

Logic block diagram

A physical picture

performance parameter

Virtex UltraScale+ series FPGA processor ：XCVU13P-2FHGB2104I;

Processing performance ：
 Logical resources ：3780K Logic Cells;
 DSP Slices：12288 individual ;
 GTY Transceivers：76 individual 32.75Gbps;

Dynamic storage performance ：
 Dynamic storage quantity ：2 Group DDR4 SDRAM;
 Dynamic storage capacity ： Each group 4GByte, Each particle is 8GBit;
 Dynamic storage bandwidth ： Working clock 1000MHz, data rate 2000Mbps;

Interconnection performance ：
 FPGA And FMC1：GTY [email protected]/lane;
 FPGA And FMC2：GTY [email protected]/lane;
 FPGA And FMC3：GTY [email protected]/lane;
 FPGA And FMC4：GTY [email protected]/lane;
 FPGA And optical fiber ：6 individual GTY [email protected]/lane;
 FPGA And NVME：x4 [email protected]/lane;
 FPGA And J30J：10 road GPIO

Physical and electrical characteristics
 Board size ：255 * 290mm
 Board power supply ：6A [email protected]+12V（±5%）
 The way of cooling ： Metal cooling conduction + Air cooling

Environmental characteristics
 working temperature ：-40°~﹢85°C,
 Storage temperature ：-55°~﹢125°C;
 Working humidity ：5%~95%, non-condensing

Software support

 Optional integrated board level software development kit （BSP）：
 DSP Bottom interface driver ;
 FPGA Bottom interface driver ;
 Board level interconnection interface driver ;
 be based on FMC AD/DA The bottom driver of the sub card ;
 Customized algorithm and system integration can be provided according to requirements ：

Technology and demand docking wechat ：W_soul911