Comparison of advantages and disadvantages between SD NAND and EMMC

  Recently, we have come into contact with some customers , Originally, the customer planned to use eMMC, But I always feel dissatisfied . Later, I made in-depth communication with customers . What do you really want eMMC Well ？ The answers they give are ： The smallest eMMC; The most convenient for welding eMMC; Minimum capacity eMMC; pin With the fewest feet eMMC; The lowest power consumption eMMC; Erase the one with the longest life eMMC; Use SLC NAND Wafer eMMC; The most stable eMMC etc. .

    We analyzed according to the requirements of customers , Think CS creation SD NAND More suitable for these customers .CS creation  SD NAND It's a mini eMMC; 6*8mm Small size ; Minimum capacity 128MB, Better cost ; 8pin foot , Easy to weld ; built-in SLC wafer ,10 Ten thousand erasures ; compatible SDIO, Stick and use ; SD NAND and eMMC On the architecture , Like a brother , All built-in NAND Flash wafer +NAND Flash controller +Firmware.

    About CS creation  SD NAND For details, please refer to the link ：SD NAND- Leilong Development Co., Ltd . that SD NAND and eMMC What are the differences ？ Put... Here CS creation SD NAND and eMMC Features are listed ：

   It can be seen that customers have the following needs , choice SD NAND than eMMC More suitable :

   1： Need small chip size . Chip mounted SD The card is 6*8mm;eMMC yes 11.5*13mm;

   About their size and packaging , Let me show you a comparison of the physical picture of this product （ From left to right ）

     2： Require small capacity .SD NAND yes 128MB-4GB;eMMC Capacity ≥16GB;

     3： Long erasure life is required , Scratch resistant .SD NAND It's built in SLC NAND Flash wafer , The number of erasures can reach 5~10 Ten thousand times ; eMMC Use MLC wafer , Erasure life 3 Thousand times    （ non-mainstream ）,TLC wafer , The erasure life is generally 500 Times or so （ Main stream ）.

    4： It is required to facilitate welding ,pin Foot less . SD NAND LGA-8 encapsulation , Machine stickers and hand stickers are convenient ; eMMC yes 153 Ball,BGA encapsulation , The difficulty of welding has increased a lot .

    5： Adopted by customers CPU Itself does not support eMMC Interface , It also needs mass storage . This is in MCU Often encounter on the platform . Now CS creation  SD NAND It's the only choice  .

    6： Yes PCB The number of plate layers is required to be relatively small . Many customers make some similar toys , Small household appliances and other products . Basically 2 Laminates are enough . If you use it at this time eMMC, that PCB The board should at least become 4 layer . It will increase the difficulty of hardware wiring and PCB Cost of .

   Then when to use eMMC It's more suitable ？

   1, The capacity demand is relatively large .>= 8GB when .

   2, Master support eMMC.

   3,PCB The board area is large enough and the number of layers > 4 layer . Use eMMC, Need to reserve 11.5*13mm Space ‘PCB At least 4 Laminate , Blind holes need to be buried ;BGA 153 individual ball,0.5mm Of pin spacing .

    Want to know CS creation  SD NAND For more information , Please click the link :SD NAND- Leilong Development Co., Ltd .

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