High performance pxie data preprocessing board based on kinex ultrascale series FPGA (ku060 +fmc sub card interface)

PXIE302 It's based on 3U PXIE High performance data preprocessing of bus architecture FMC Carrier plate , The board has 1 individual FMC+（HPC） Interface ,1 individual X8 GTH Backplane interconnection interface , Can achieve 1 road PCIe x8. The board uses Xilinx A high performance KintexUltraScale series FPGA As a real-time processor , Realization FMC Interface data collection 、 Handle 、 And backplane interface interconnection . On board 1 Group independent 72 position DDR4 SDRAM Large capacity cache . The board is equipped with different FMC Sub card , Can be built quickly 3U PXIE system platform , Realize the preprocessing of front-end data , It can be widely used in radar and if signal acquisition 、 Video image acquisition and other scenes .

A physical picture

Functional block diagram

performance parameter

 On board FPGA Real time processors ：XCKU060-2FFVA1517;
 And XCKU085-2FFVA1517I as well as XCKU115-2FFVA1517I Can be real
present PIN-PIN compatible , Upgradeable FPGA Resource capacity ;
 Backplane interconnection interface ：
 X8 GTH interconnection ;
 Support PCIe gen3 [email protected]/lane;
 independent XDMA controller , The theoretical bandwidth is as high as 64Gbps;
 Support SMBUS Bus management ;
 FMC Interface indicators ：
 standard FMC+（HPC） Interface , accord with VITA57.4 standard ;
 Support x24 [email protected]/lane High speed serial bus ;
 Support 80 Yes LVDS The signal ;
 Support IIC Bus interface ;
 +3.3V/+12V/+VADJ Power supply , Power supply ≥15W;
 independent VIO_B_M2C Power supply （ It can be provided by sub card ）;
 Dynamic storage performance ：
 Storage bandwidth ：72 position ,DDR4 SDRAM,1200MHz Working clock ;
 storage capacity ： The biggest support 4GByte DDR4 SDRAM;
 Other interface performance ：
 8 road LVTTL GPIO Interface ,1 road RS422 Interface ;
 1 road RJ45 Gigabit Ethernet Interface ,1 road USB3.0 Interface ;
 On board 2 individual SPI Flash be used for FPGA Loading ;
 Physical and electrical characteristics
 Board size ：100 x 160mm;
 Board power supply ：4A [email protected]+12V（±5%, It does not include power supply for sub cards ）;
 The way of cooling ： Air cooling ;
 Working humidity ：5%~95%, non-condensing

Software support

 Optional integrated board level software development kit （BSP）：
 FPGA Bottom interface driver ;
 PCIe Bus interface development and its driver ;
 Customized algorithm and system integration can be provided according to customer requirements ：

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